Improve Your Yields Through Innovation International Test Solutions provides non-destructive probe card cleaning products used by semiconductor manufacturers to remove debris and contaminants generated during wafer level and burn-in/test socket testing. By removing loose debris and adherent contaminants in-line, the quality of the testing data is improved, the test equipment downtime is reduced, throughput is increased and manufacturing yields are improved. Non-destructive probe card cleaning and probe needle cleaning products for wafer level test applications. For more information about International Test Solutions, please visit their web site.
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